PATI features versions pdf
PC/104-Plus PowerPC controlled Analog and Timing I/O Intelligence
[PATI]

The PATI is a highly integrated I/O Board in PC/104-Plus form factor. Build around the MPC555 Motorola PowerPCTM Processor and the PLX9056 PCI Bridge it brings the superb MPC555 peripherals to a standard PCI Interface.

With the possibilities for firmware update over the PCI bus, parameter passing via the on-board SDRAM, allowing the PATI to access the host memory via PCI busmaster access and various configurations options it is well suited for fast prototyping application.

A stand-alone mode allows the PATI to work without the host. Application developed and tested in a host environment can be executed on the PATI in the stand-alone mode without any code modification.

The MPC555 peripherals are available on 2 standard 50 pin 2.54 mm header which offers easy connections. It features 8 differential 10bit Analog/Digital channels, 32bit TPU channels, 2 serial interfaces and 2 CAN interfaces

PATI Specialities


Technical Features

Reference Description
CPU MPC555 / 40MHz
PCI 32Bit / 33MHz Master/Slave Target only
RAM 16MByte SDRAM (max. physical address range of MPC555)
Flash up to 8MByte
Analog 8 x Input 25kHz sampling rate (each) 10kHz bandwidth
TPU 32 Channel
CAN 2 x CAN 2.0B
Power 5V only (Switcher for 3.3V onboard)

PATI Versions

Reference Description
PATI-1 PC/104-Plus module with 2x CAN, 8x 10-bit ADC channels, 32 TPU channels, 2x RS232, 16Mb SDRAM and 8MB Flash. (loaded with special Mathworks Firmware)
PATI-2 PC/104-Plus module with 2x CAN, 8x 10-bit ADC channels, 32 TPU channels, 2x RS232, 16Mb SDRAM and 8MB Flash. (loaded with standard MPL Firmware)
PATI-Cx  Customer specific versions, please contact MPL for details.

Extended Temperature Option

Reference Description
XTEST-1 Extended temperature test, -40°C up to +85°C

Für den Einsatz in rauher Einsatzumgebung kann die PATI Karte für den erweiterten Temperaturbereich von -40/+85°C bestellt werden. Jede ausgelieferte PATI muß verschiedene Tests im Klimaschrank absolvieren, um mögliche Materialfehler über das gesamte Temperaturprofil aufzuzeigen.


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